TWM has been named a 2024 Finalist by the St. Louis Business Journal as one of the Best Places to Work. Nearly 200 St. Louis-area companies were nominated, with 83 selected as top employers. TWM is one of 21 honorees in the Large Employer category (100-249 employees).

The list is based solely on employee feedback gathered through a third-party survey. The anonymous and confidential survey measures several aspects of workplace culture, including alignment, execution, and connection, just to name a few.

“We are incredibly proud of our team of A-players and our shared accomplishments. This achievement is a result of the efforts and support of our employee-owners, our greatest asset,” said Jennifer Wolkiewicz, TWM Director of Human Resources. “It reaffirms and reflects our commitment to cultivate a workplace of collaboration, growth, and well-being for every member of our team.”

TWM nurtures a culture of excellence – from seasoned professionals to part-time interns – and offers ample opportunities for growth, mentorship, and personal development. A 100% ESOP-owned company, TWM attributes its success to the collective efforts of its talented team members and fosters an environment where everyone feels empowered to contribute and create a positive impact.

About TWM, Inc.
Celebrating 78 years in business, TWM is a 100% employee-owned firm providing civil and structural engineering, land surveying, and other geospatial services. From our humble beginnings in Belleville, IL in 1946, TWM has grown to the successful firm it is today, with its corporate headquarters in Swansea, IL and now 10 additional offices throughout the Midwest and Southeast. Our five primary disciplines include Transportation, Land Survey/Geospatial Services, Land Development, Structural, and Water Infrastructure. As a full-service engineering consultant, TWM prides itself on being able to provide a broad range of design projects and related services, while delivering on its company mission of Exceptional Service. Nothing Less.

Learn more about TWM.